News
Production Facility Upgrade
Published on 01 November 2017
In line with our commitment to invest to keep our operation running efficiently we have upgraded our production facilities with the addition of an IBL vapour phase solder reflow machine and an TWS solder paste printing machine.
Vapour phase reflow soldering provides exceptional quality soldering regardless of mass or complexity of the printed circuit board. It provides an inert atmosphere for the soldering process ensuring excellent quality solder joints.
The TWS solder paste printing machine will improve the efficiency and accuracy of our paste printing process and together with our new reflow maching will significantly improve the overall efficiency of our surface mount board assembly operation.